LEDs on adhesive transfer tape

ABSTRACT

The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and one or more light-emitting diodes (LEDs) are disposed on the adhesive layer and coupled to the power wires.

FIELD OF THE INVENTION

The disclosure generally relates to approaches for deliveringelectronics on adhesive transfer tape.

BACKGROUND

There are a number of applications in which electronics are attached tovarious articles. The electronics may provide a function that isancillary to the function of the article or may work in conjunction withthe article to provide a desired function. Radio frequencyidentification (RFID), near-field communication, and light-emittingdiode (LED) lighting are examples of such applications.

RFID applications vary from inventory control to traffic management topet identification. RFID systems generally include readers and tags.RFID tags are affixed to the articles to be tracked, and the RFID readeremits a signal to activate the RFID tag. The RFID tag may respond byreading data from a memory and emitting a signal with the desiredinformation for the RFID reader.

LED-based lighting is becoming more popular due in part to the energyefficient qualities and durability of LEDs. Applications for LED-basedlighting may include advertising signage, decorations, or utility andgeneral purpose lighting.

For some applications, RFID tags or LEDs are mounted on a flexiblesubstrate such as those made from polyamides or polyimides. Prior tomounting the electronic device, wiring patterns may be formed on thesubstrate using a print-and-etch process. The wiring patterns are laidout to accommodate placement of one or more devices on the substrate atdesired locations.

Making RFID tags or LED arrangements using a polyamide or polyimidesubstrate may be prohibitively expensive for some applications. Theexpense is attributable in part to the print-and-etch processes used increating the wiring pattern. Expensive chemicals are required forprint-and-etch processes, and hazardous waste is a byproduct.

SUMMARY

In one implementation, a lighting arrangement includes adhesive transfertape. The adhesive transfer tape has an adhesive layer disposed directlyon a release liner, and the release liner is separable from the adhesivelayer. Power wires are adhered directly to the adhesive layer, and oneor more light-emitting diodes (LEDs) are disposed on the adhesive layerand coupled to the power wires.

A method of making a lighting arrangement includes unrolling a portionof an adhesive transfer tape from a first roll. The adhesive transfertape includes a release liner and an adhesive layer disposed directly onthe release liner. At least one light emitting diode is attached to theadhesive layer on the unrolled portion of the adhesive transfer tape,and power wires are directly attached to the adhesive layer on theunrolled portion of the adhesive transfer tape. The power wires arecoupled to the at least one LED, and the unrolled portion of theadhesive transfer tape is rolled on to a second roll.

Other embodiments will be recognized from consideration of the DetailedDescription and Claims, which follow.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects and advantages of the disclosed embodiments will becomeapparent upon review of the following detailed description and uponreference to the drawings in which:

FIG. 1 shows a roll of adhesive transfer tape in which multipletransponder arrangements are affixed directly to the adhesive on thetape;

FIG. 2 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape;

FIG. 3 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape being affixed to a target article;

FIG. 4 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape having been affixed to a target article and therelease liner being removed from the adhesive transfer tape;

FIG. 5 is a cross-sectional view of a transponder arrangement adhered tothe adhesive layer from an adhesive transfer tape having been affixed toa target article, having had the release liner removed from the adhesivetransfer tape, and having a permanent backing affixed to the adhesivelayer;

FIG. 6 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape having two release liners;

FIG. 7 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape where the RF transponder is disposed on a strap;

FIG. 8 shows a roll of adhesive transfer tape in which multiple LEDs areaffixed to the adhesive layer of the adhesive transfer tape;

FIG. 9 is a cross-sectional view of an LED and strap affixed directly tothe adhesive layer of an adhesive transfer tape. The cross-sectionalview shows an LED that is attached to a strap;

FIG. 10 is a cross-sectional view of an LED and strap affixed directlyto the adhesive layer of an adhesive transfer tape and the LEDencapsulated in a phosphor-filled material;

FIG. 11 is a cross-sectional view of an LED and strap affixed directlyto the adhesive layer of an adhesive transfer tape where thelight-emitting portion of the LED faces the adhesive layer through anaperture in the strap;

FIG. 12 is a cross-sectional view of an LED and strap affixed directlyto the adhesive layer of an adhesive transfer tape where thelight-emitting portion of the LED faces the adhesive layer through anaperture in the strap, and the LED is encapsulated in a phosphor-filledmaterial; and

FIG. 13 is a flowchart of a process of making a roll of electronicdevices on an adhesive transfer tape.

DETAILED DESCRIPTION OF THE DRAWINGS

In conventional applications, adhesive transfer tape provides amechanism for applying a strip of adhesive to a target article. Theadhesive strip has two opposing adhesive surfaces for attaching oneobject to another. The adhesive strip of the adhesive transfer tape mayoptionally have an embedded web for reinforcement.

In a departure from conventional uses of adhesive transfer tape,electronic devices and communication and/or power wiring for the devicesare directly attached to the adhesive layer on the adhesive transfertape. There are no backing or substrates for the devices and wiringother than the adhesive layer itself.

The arrangements described herein provide convenient manners ofdelivering an electronic device, which can then be affixed to a desiredarticle. In one approach, an electronic device is affixed to an adhesivetransfer tape. The adhesive transfer tape has an adhesive layer disposeddirectly on a first release liner. Electrical wiring for power and/orcommunication is directly adhered to the adhesive layer of the adhesivetransfer tape. The electronic device is also disposed on the adhesivelayer, either directly or mounted on a strap, which is directly adheredto the adhesive layer. The adhesive layer is separable from the releaseliner without destruction of the adhesive layer, the adherence of thewiring and electronic device to the adhesive layer, or the coupling ofthe wiring to the electronic device.

As further described in the following paragraphs, examples of the typesof electronic devices that may be affixed to the adhesive of an adhesivetransfer tape include RF transponders for RFID or near fieldcommunication applications or LED arrangements for lightingapplications. An adhesive transfer tape having RF transponders or LEDarrangements is well suited for RFID or near field communicationapplications or lighting applications. Providing the electronic devicesand wiring directly on the adhesive of adhesive transfer tape is muchless costly than deploying the circuitry on flexible substrates such aspolyamide or polyimide. Also, the adhesive transfer tape providesflexibility in manufacturing in that the adhesive with the electronicscan be easily applied to application-specific backings or targetarticles. The structure also enhances tamper resistance since theelectronic device and wiring are backed only by the adhesive. An attemptto remove the device and wiring from an article to which the adhesive,device, and wiring are affixed would likely destroy the wiring and/orconnections to the device. Though the described structures are of RFtransponders and LEDs, it will be appreciated that other types ofelectronic devices and wiring may be provided by way of adhesivetransfer tape as described herein.

FIG. 1 shows a roll 102 of adhesive transfer tape in which multipletransponder arrangements are affixed directly to the adhesive on thetape. Five transponder arrangements are illustrated on an unrolledportion of the adhesive transfer tape. Additional transponderarrangements are disposed on the rolled portion of the adhesive transfertape and are not visible. Each transponder arrangement includes anantenna and an RF transponder. For example, one of the transponderarrangements includes RF transponder 104 and antenna 106.

In each transponder arrangement, the antenna 106 is adhered directly tothe adhesive layer 110. The RF transponder 104 may either be directlyadhered to the adhesive layer or mounted on a strap (not shown), whichis directly adhered to the adhesive layer.

The adhesive transfer tape includes a release liner 108 and an adhesivelayer 110. The release liner 108 is coated on both of surfaces 112 and114 with release agents to create a differential release. That is, moreforce is required to separate the adhesive layer from surface 114 of therelease liner than is required to separate the adhesive layer fromsurface 112 of the release liner.

The transponder arrangements may be easily applied to target articles.As the roll of adhesive transfer tape is unrolled, a section of theadhesive transfer tape having an individual transponder arrangement maybe cut or otherwise separated from the tape. The individual transponderarrangement may then be attached to a target article by forcing theexposed surface 118 of the adhesive against a surface of the targetarticle. The target article thereby provides a protective backing forone surface of the transponder arrangement. The release liner on theseparated section of adhesive transfer tape may then be removed and aprotective covering may be adhered to the exposed surface of theadhesive layer.

Each of the transponder arrangements on the roll may be constructed asshown and described in the following figures.

FIG. 2 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape. The adhesive transfer tape includes releaseliner 108 and adhesive layer 110. The RF transponder 152 is directlyadhered to the adhesive layer as is the antenna wiring 154. Terminalends 156 of the antenna wiring are connected to the RF transponder.

In an example implementation, the adhesive layer 110 is apressure-sensitive adhesive. This allows the RF transponder 152 andantenna wiring 154 to be easily affixed to the adhesive transfer tape byforcing the RF transponder and antenna wiring against the surface of theadhesive layer. Also, each transponder arrangement and the section ofadhesive from the adhesive transfer tape may be easily affixed to atarget article.

The configuration of the antenna wiring 154 may vary according to designand application requirements. For example, the antenna wiring may bebare wire or wire 158 with an insulating coating 160 as shown. It willbe appreciated that wire as used herein does not refer to printed orprinted-and-etched patterns of conductive material. Rather, as usedherein, wire refers to one or more strands of conductive material thathave been made by drawing the conductive material through draw plates,for example. In one embodiment, the antenna wiring 154 is a fine gaugebare wire. For example, 44 gauge (AWG) copper wire has been found to besuitable for some applications. However, different gauges may besuitable for different applications. Though a coil antenna is shown, itwill be recognized that the disclosed structures are adaptable for anyof the many different antenna patterns known in the art and suitable forRFID and near field communication applications.

FIGS. 3, 4, and 5 show a sequence in which a transponder arrangement onan adhesive transfer tape is affixed to a target article.

FIG. 3 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape being affixed to a target article 202. Theexposed surface 118 of the adhesive layer 110 faces surface 204 of thetarget article 202 and the adhesive transfer tape with the transponderarrangement is forced against the target article in the direction shownby arrow 206. The adhesive surrounding the transponder arrangement, forexample, the portion 208 of adhesive layer 110 and the adhesive beyondline 210 on the adhesive transfer tape, attaches the tape andtransponder arrangement to the article.

The target article is application dependent. For example, the targetarticle may be a card-sized substrate, a product or product package, awindshield, luggage, or myriad other objects.

FIG. 4 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape having been affixed to a target article and therelease liner being removed from the adhesive transfer tape. Once theadhesive transfer tape with the transponder arrangement is affixed tothe target article 202, the release liner 108 may be removed from theadhesive layer 110 by peeling the release liner in the direction ofarrow 212.

FIG. 5 is a cross-sectional view of a transponder arrangement adhered tothe adhesive layer from an adhesive transfer tape having been affixed toa target article, having had the release liner removed from the adhesivetransfer tape, and having a permanent backing affixed to the adhesivelayer. After the release liner 108 (FIG. 4) has been removed from theadhesive layer 110, a permanent backing 218 may be affixed to theadhesive layer 110. Though the permanent backing is shown as a thinlayer of material, it will be recognized that different dimensions andtypes of materials may be suitable for different application and designrequirements.

It will be appreciated that different antenna configurations will resultin different portions of the adhesive layer contacting the targetarticle and the permanent backing. For a tightly wound antenna coil noadhesive would contact the target article between adjacent loops of thecoil. For example, if loops 232, 234, and 236 were closer together, thenadhesive portions 238 would not attach to the surface of the targetarticle. However, for a coil in which adjacent loops are sufficientlyseparated, the adhesive portions 238 would attach to the target articlebetween the loops.

FIG. 6 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape having two release liners. Rather than the singlerelease liner 108 of the implementation shown in FIG. 2, the adhesivetransfer tape has two release liners, release liner 302 and releaseliner 304. The surface of release liner 302 that is directly in contactwith the adhesive layer 110 is coated with a first release agent, andthe surface of release liner 304 that is directly in contact with theadhesive layer is coated with a second release agent. The differentrelease agents create a differential release between release liners 302and 304 and the adhesive layer 110.

FIG. 7 is a cross-sectional view of a transponder arrangement on anadhesive transfer tape where the RF transponder is disposed on a strap.The adhesive transfer tape includes release liner 322 and adhesive layer324. The transponder arrangement, which is directly disposed on theadhesive layer, includes RF transponder 326, strap 328, and antennawiring 330. The RF transponder is directly attached to a surface of thestrap and is coupled to the antenna wiring via the strap.

The strap 328 is directly attached to the adhesive layer 324. The RFtransponder 326 is attached to contact pads 332 and 334 on the strap bysoldered connections, for example. Metal traces 336 and 338 on the straplead from the contact pads 332 and 334 to terminals 340 and 342. In anexample implementation, the RF transponder is connected to the metaltraces 336 and 338 by way of conductive vias. The strap may be made frompolyamide or polyimide for example. Metal traces may be printed andetched to provide the bond pads for the RF transponder and the terminalsfor connecting the antenna wiring. In other implementations, the strapmay be made from various polyesters, polyethylene naphthalate (PEN), orvinyl, and metal traces may be formed accordingly.

Being on the surface of the strap that faces away from the adhesivelayer 324, the terminals 340 and 342 are thereby exposed for connectionto leads of the antenna. Terminal end 344 of the antenna wiring 330 iselectrically connected to terminal 340 on the strap, and terminal end346 of the antenna wiring is electrically connected to terminal 342 onthe strap. The wire may be soldered to the terminals or attached to theterminals with a conductive adhesive, for example. In an alternativeimplementation, both of terminals 340 and 342 may be on the same side ofthe RF transponder rather than on opposite sides as shown.

The strap may reduce manufacturing costs. The process of connecting theantenna wiring to the RF transponder may be simplified because thewiring is laid over the exposed terminals on the strap. Instead ofhaving to blindly align terminals of the strap with wiring that had beenpreviously laid out on the substrate, the wires are laid over andconnected to the visible terminals on the strap.

FIG. 8 shows a roll 400 of adhesive transfer tape in which multiple LEDsare affixed to the adhesive layer of the adhesive transfer tape. FourLED arrangements are illustrated on an unrolled portion of the adhesivetransfer tape. Additional LED arrangements are disposed on the rolledportion of the adhesive transfer tape and are not visible. Each LEDarrangement includes a strap and one or more LEDs. For example, the oneor more LEDs of one of the LED arrangements are shown as element 402,and the strap of the LED arrangement is shown as element 404. In eachLED arrangement, the strap is adhered directly to the adhesive layer410. In another implementation, the LEDs may be directly adhered to theadhesive layer without the use of a strap.

Power and optional control wires 406 are directly adhered to theadhesive layer 410 and connect the LED arrangements. The wires may bebare wire or wire with an insulating coating. In one implementation, thewires 406 are fine gauge bare wires. For example, 44 gauge (AWG) copperwire has been found to be suitable for some applications. However,different gauges may be suitable for different applications.

The adhesive transfer tape includes a release liner 408 and an adhesivelayer 410. The release liner 408 is coated on both of surfaces 412 and414 with release agents to create a differential release. That is, moreforce is required to separate the adhesive layer from surface 414 of therelease liner than is required to separate the adhesive layer fromsurface 412 of the release liner.

In an example implementation, the adhesive layer 410 is apressure-sensitive adhesive. This allows a string of LED arrangementsand wiring to be easily affixed to the adhesive transfer tape by forcingthe LED arrangements and wiring against the surface of the adhesivelayer. Also, a string of LED arrangements and a section of adhesive fromthe adhesive transfer tape may be easily affixed to a target article.

A string of the LED arrangements may be easily applied to targetarticles. As the roll of adhesive transfer tape is unrolled, a desirednumber of LED arrangements may be attached to a target article byforcing the exposed surface 418 of the adhesive against a surface of thetarget article. Once the string of LED arrangements is affixed to thetarget article, the unrolled portion of the adhesive transfer tape maybe cut or otherwise separated from the roll. The exposed ends 422 and424 of the wiring may then be connected to power and/or control sources.The target article thereby provides a supportive and/or protectivebacking for one surface of the string of LED arrangements. The releaseliner on the separated section of adhesive transfer tape may be removedand a protective covering may be adhered to the exposed adhesive layer.The target article and/or the protective covering may have openings orapertures formed therein to align with LEDs of the LED arrangements inorder to permit the passage of light.

The LED arrangements on adhesive transfer tape may be beneficial for usein graphics applications where complex layouts of LEDs and low-costsubstrates are required. Such applications contemplate large sheets offlexible substrate material, for example for signs that are greater than10 square feet. It will be recognized, however, that the embodiments maybe suitable for nearly any size application.

Each of the LED arrangements on the roll may be constructed as shown anddescribed in the following figures.

FIG. 9 is a cross-sectional view of an LED and strap affixed directly tothe adhesive layer of an adhesive transfer tape. The cross-sectionalview shows an LED 552 that is attached to a strap 554. The strap isadhered directly to an adhesive layer 410 of adhesive transfer tape. Theadhesive layer is disposed on the release liner 408. For ease ofillustration, the LED 552 is depicted as a simple block. Given thatthere are myriad bare LED and packaged LED structures, suitableorientations and connections of the LED to the strap will be recognizedfor the different embodiments even though the LED is depicted as ablock.

The LED 552 is electrically connected to metal traces 556 and 558 bysoldered connections, for example. The metal traces on the strap 554lead from the pads at which the LED is connected to terminals 560 and562. Being on the surface of the strap that faces away from the adhesivelayer 410, the terminals are thereby exposed for connection to power andoptional control wiring. Wire 564 is electrically attached to terminal560, and wire 566 is attached to terminal 562. The wires may be solderedto the terminals or attached to the terminals with a conductiveadhesive.

For a packaged LED, a light-emitting surface 568 of LED 552 faces awayfrom the strap 554. For an unpackaged LED, a mirror layer 570 may besputtered on the strap to reflect light, which is emitted from the LEDaway from the strap. The sputtered mirror layer may be a highlyreflective metallic material, for example.

Similar to the structure shown in FIG. 6 in which the transponderarrangement is directly disposed on the adhesive layer of adhesivetransfer tape and the tape has two release liners, the adhesive transfertape having the LED arrangements of FIGS. 8 and 9 may have two releaseliners.

Though only one LED 552 is shown in FIG. 9, it will be recognized thatmultiple LEDs may be mounted on a single strap.

FIG. 10 is a cross-sectional view of an LED and strap affixed directlyto the adhesive layer 410 of an adhesive transfer tape and the LED isencapsulated in a phosphor-filled material. The LED 604 is encapsulatedin jettable phosphor-filled material 606. The phosphor in the materialtransforms the blue light emitted from the LED into white light. In oneembodiment, the phosphor-filled material 606 is a phosphor-filledsilicone.

The phosphor-filled material is jettable, which permits the material tobe injected into the area between the LED 604 and the mirror coating 570on the strap 554. Thus, the encapsulation of the LED produces thedesired shift in lighting as well as sealing the LED-to-strapconnections from corrosive contaminants.

FIG. 11 is a cross-sectional view of an LED 622 and strap 624 affixeddirectly to the adhesive layer 410 of an adhesive transfer tape wherethe light-emitting portion 626 of the LED faces the adhesive layerthrough an aperture 628 in the strap. In an example alternativeimplementation (not shown), the aperture may extend through both thestrap and the adhesive layer. For an unpackaged LED, a mirror layer 630may be sputtered on a surface of the LED to reflect light, which isemitted from the LED toward the aperture in the strap.

FIG. 12 is a cross-sectional view of an LED 652 and strap 654 affixeddirectly to the adhesive layer 410 of an adhesive transfer tape wherethe light-emitting portion of the LED faces the adhesive layer throughan aperture 656 in the strap, and the LED is encapsulated in aphosphor-filled material 658. The LED is encapsulated in jettablephosphor-filled material, such as a phosphor-filled silicone. For anunpackaged LED, a mirror layer 660 may be sputtered on a surface of theLED to reflect light, which is emitted from the LED toward the aperturein the strap. The adhesive layer may be clear or translucent.

FIG. 13 is a flowchart of a process of making a roll of electronicdevices on an adhesive transfer tape. At block 950 a portion of a firstroll of adhesive transfer tape is unrolled, exposing the adhesive layerof the tape on the unrolled portion and leaving the adhesive attached tothe release liner. One or more electronic devices, such as RFIDtransponders or LED arrangements, are attached directly to the adhesivelayer on the unrolled portion of the tape at block 952. With apressure-sensitive adhesive, the devices may be attached by forcing thedevices against the surface of the adhesive. At block 954, wiring forthe devices is attached directly to the adhesive layer, and the wiringis connected to the devices at block 956. The connections may be made byway of low-temperature soldering or with a conductive adhesive. Afterattaching the devices, and connecting the wiring to the devices on theunrolled portion of the adhesive transfer tape, the unrolled portion isrolled onto a second roll at block 958. The process may be repeated andcontinued until the roll of adhesive transfer tape has been filled withelectronic devices. The process of FIG. 13 may be performed using thestructures of FIGS. 1-12 according to design and implementationrequirements.

Terms such as over, under, top, bottom, above, below, may be used hereinto refer to relative positions of elements as shown in the figures. Itshould be understood that the terminology is used for notationalconvenience only and that in actual use the disclosed structures may beoriented different from the orientation shown in the figures. Thus, theterms should not be construed in a limiting manner.

Though aspects and features may in some cases be described in individualfigures, it will be appreciated that features from one figure can becombined with features of another figure even though the combination isnot explicitly shown or explicitly described as a combination. Theembodiments are thought to be applicable to a variety of LED lightingarrangements. Other aspects and embodiments will be apparent to thoseskilled in the art from consideration of the specification. It isintended that the specification and illustrated embodiments beconsidered as examples only, with a true scope of the invention beingindicated by the following claims.

What is claimed is:
 1. A lighting arrangement, comprising: adhesivetransfer tape that includes an adhesive layer having opposing first andsecond adhesive surfaces, and at least one release liner, wherein the atleast one release liner is directly adhered to both the first and secondadhesive surfaces and separable from both the first and second adhesivesurfaces of the adhesive layer; power wires adhered directly to thesecond adhesive surface and including a first power wire and a secondpower wire; and a plurality of light emitting diodes (LEDs) disposed onthe second adhesive surface and coupled to the first power wire and thesecond power wire.
 2. The lighting arrangement of claim 1, wherein theat least one release liner includes a first release liner disposeddirectly on the first adhesive surface and a second release linerdisposed on the power wires and the plurality of LEDs, and disposeddirectly on the second adhesive surface.
 3. The lighting arrangement ofclaim 2, wherein: a surface of the first release liner directly incontact with the first adhesive surface-is coated with a first releaseagent; a surface of the second release liner directly in contact withthe second adhesive surface is coated with a second release agent; andthe surface of the first release liner directly in contact with thefirst adhesive surface has a differential release from the surface ofthe second release liner directly in contact with the second adhesivesurface.
 4. The lighting arrangement of claim 1, wherein the pluralityof LEDs are adhered directly to the second adhesive surface.
 5. Thelighting arrangement of claim 1, further comprising: a strap adhereddirectly to the second adhesive surface and coupled to the power wires;and wherein the plurality of LEDs are disposed directly on the strap andare coupled to the power wires via the strap.
 6. The lightingarrangement of claim 5, wherein the strap has a first surface, a secondsurface, and first and second terminals exposed on the first surface,wherein the second surface of the strap is directly adhered to thesecond adhesive surface, and the power wires are attached to the firstand second terminals.
 7. The lighting arrangement of claim 6, furthercomprising a phosphor-filled material encapsulating each LED of theplurality of LEDs attached to the strap.
 8. The lighting arrangement ofclaim 6, wherein the strap has an aperture, and a light emitting portionof each LED of the plurality of LEDs attached to the strap faces thesecond adhesive surface at the aperture.
 9. The lighting arrangement ofclaim 8, further comprising a phosphor-filled material encapsulatingeach LED of the plurality of plurality of LEDs attached to the strap,and the phosphor-filled material filling the aperture in the strap. 10.The lighting arrangement of claim 6, further comprising, a mirror layerdisposed on the strap and between each LED of the plurality of LEDsattached to the strap and the strap.
 11. The lighting arrangement ofclaim 6, wherein the strap has an aperture, and a light emitting portionof each LED of the plurality of LEDs attached to the strap faces theadhesive layer at the aperture, and the arrangement further comprising amirror layer disposed on each LED of the plurality of LEDs over aportion of each LED.
 12. The lighting arrangement of claim 6, whereinthe plurality of LEDs are unpackaged.
 13. The lighting arrangement ofclaim 6, wherein the plurality of LEDs are packaged.
 14. The lightingarrangement of claim 6, wherein the power wires are electricallyattached to the first and second terminals on the strap with aconductive adhesive.
 15. The lighting arrangement of claim 1, whereinthe adhesive layer is a pressure-sensitive adhesive.
 16. The lightingarrangement of claim 1, wherein the power wires comprise bare wireadhered directly to the second adhesive surface.
 17. The lightingarrangement of claim 1, wherein the power wires comprise insulated wireadhered directly to the second adhesive surface.
 18. The lightingarrangement of claim 1, wherein: the at least one release liner, theadhesive layer, the power wires, and the plurality of LEDs are coiledinto a roll.
 19. The lighting arrangement of claim 18, wherein the atleast one release liner has a first surface coated with a first releaseagent and a second surface coated with a second release agent, the atleast one release liner having a differential release between theadhesive layer and the first and second surfaces.
 20. The lightingarrangement of claim 18, wherein the at least one release liner includesa first release liner disposed directly on the first adhesive surfaceand a second release liner disposed on the power wires and on theplurality of LEDs, and disposed directly on the second adhesive surface.21. The lighting arrangement of claim 20, wherein: a surface of thefirst release liner directly in contact with the first adhesive surfaceis coated with a first release agent; a surface of the second releaseliner directly in contact with the second adhesive surface is coatedwith a second release agent; and the surface of the first release linerdirectly in contact with the first adhesive surface has a differentialrelease from the surface of the second release liner directly in contactwith the second adhesive surface.
 22. The lighting arrangement of claim18, wherein the plurality of LEDs are adhered directly to the secondadhesive surface.
 23. The lighting arrangement of claim 18, furthercomprising: a plurality of straps adhered directly to the secondadhesive surface and coupled to the power wires; and wherein each of theplurality of LEDs is disposed directly on one of the plurality of strapsand is coupled to the power wires via the strap.
 24. The lightingarrangement of claim 23, wherein each strap of the plurality of strapshas a first surface, a second surface, and first and second terminalsexposed on the first surface, the second surface of the strap isdirectly adhered to the second adhesive surface, and the power wires areattached to the first and second terminals.
 25. The lighting arrangementof claim 18, wherein the adhesive layer is a pressure-sensitiveadhesive.
 26. The lighting arrangement of claim 18, wherein the powerwires comprise bare wire adhered directly to the second adhesivesurface.
 27. The lighting arrangement of claim 18, wherein the powerwires comprise insulated wire adhered directly to the second adhesivesurface.
 28. A method of making a lighting arrangement, comprising:unrolling a portion of an adhesive transfer tape from a first roll, theadhesive transfer tape including at least one release liner directlyadhered to both first and second adhesive surfaces of an adhesive layer,and the at least one release liner separable from both the first andsecond adhesive surfaces; attaching a plurality of light emitting diodes(LEDs) to the second adhesive surface on the unrolled portion of theadhesive transfer tape; attaching power wires, including a first powerwire and a second power wire, directly to the second adhesive surface onthe unrolled portion of the adhesive transfer tape; coupling the firstpower wire and the second power wire to the plurality of LEDs; androlling the unrolled portion of the adhesive transfer tape on to asecond roll.
 29. The method of claim 28, wherein the at least onerelease liner includes one release liner having a first surface coatedwith a first release agent and a second surface coated with a secondrelease agent, the first surface of the first one release liner andfirst adhesive surface having a differential release from the secondsurface of the one release liner and the second adhesive surface. 30.The method of claim 28, wherein the attaching the plurality of LEDs tothe adhesive layer includes adhering the plurality of LEDs directly tothe second adhesive surface.
 31. The method of claim 28, wherein: theattaching the plurality of LEDs to the second adhesive surface includes:adhering a plurality of straps directly to the second adhesive surface;attaching the plurality of LEDs to one of the straps; and the couplingthe power wires to the plurality of LEDs includes: coupling the powerwires to the straps.
 32. The method of claim 31, wherein each strap hasa first surface, a second surface, and first and second terminalsexposed on the first surface, and the second surface of the strap isdirectly adhered to the second adhesive surface, and the coupling thepower wires to the straps includes attaching the power wires to thefirst and second terminals on the straps.
 33. The method of claim 28,wherein the adhesive layer is a pressure-sensitive adhesive.
 34. Themethod of claim 28, wherein the power wires comprise bare wire adhereddirectly to the second adhesive surface.
 35. The method of claim 28,wherein the power wires comprise insulated wire adhered directly to thesecond adhesive surface.